The Occam Process delivers measurable advantages in reliability, thermal performance, size, and cost.
Unlike traditional manufacturing methods that require additional components or processes to achieve certain performance characteristics, the Occam Process delivers these benefits inherently—they're built into the fundamental technology.
This means you get superior performance without added complexity, cost, or potential failure points.
Heat is the enemy of electronics reliability. In traditional assemblies, heat must pass through solder joints—creating thermal bottlenecks that limit performance and lifespan.
The Occam Process creates direct thermal paths from components to thermally conductive substrates, enabling efficient heat dissipation without additional heatsinks or cooling systems.
Electromagnetic interference (EMI) and electrostatic discharge (ESD) can cause malfunctions or permanent damage in sensitive electronics. Traditional solutions require additional shielding components.
The Occam Process architecture provides inherent EMI shielding and ESD protection as part of the assembly structure itself—no additional components required.
In traditional assemblies, components sit on top of the PCB surface, connected by solder bumps. This adds height and limits how densely components can be packed.
The Occam Process embeds components directly into the substrate, dramatically reducing assembly height and enabling higher component density—critical for portable, wearable, and space-constrained applications.
Intellectual property protection is critical in competitive markets and defense applications. Traditional PCBs can be photographed and reverse-engineered with relative ease.
Because Occam Process assemblies embed components within the substrate and build circuitry around them, the design is inherently protected. Reverse engineering becomes extremely difficult and costly.
While traditional assembly processes involve multiple steps—solder paste, placement, reflow, inspection, rework—the Occam Process streamlines manufacturing through additive techniques.
Combined with dramatic improvements in field reliability (fewer failures, fewer warranty claims, fewer replacements), the total cost of ownership drops significantly.
Reliability
Thermal
EMI/ESD
Size
Security
Cost
Ready to see how the Occam Process can benefit your next project?
