The Future of High-Reliability Electronics
Solderless assembly with inherent thermal management—engineered for defense, aerospace, medical, and automotive applications where failure isn't an option.
Connect With UsWhy Choose
The Occam Group
Solderless Assembly Technology
Eliminates solder by bonding components first, removing common failure points.
Superior Reliability
Immune to solder-related failures from shock, vibration, and heat.
Inherent Thermal Management
Thermally conductive substrates naturally dissipate heat for efficient operation.
Reduced Size and Weight
Components sit closer, making assemblies smaller and lighter.
Lower Production Costs
Fewer steps, less material, and no solder rework save money.
Additive Manufacturing Compatibility
Supports rapid prototyping, short runs, and customizable designs.
The Occam Process
The Occam Process is a patented solderless assembly method, a substrate technology that delivers reliable, lower cost, and smaller electronics systems for some of the most demanding applications in the world.
Through our innovative approach, we create direct metallurgical bonds that outperform traditional solder joints in every measurable way—from thermal conductivity to mechanical strength.
Learn More About Our ProcessMarkets We Serve
From defense applications to consumer electronics, the Occam Process delivers reliability where it matters most.
Defense & Aerospace
Mission-critical reliability for the most demanding environments.
Medical Electronics
Life-saving devices that demand zero tolerance for failure.
Automotive
High-performance electronics for next-generation vehicles.
Consumer Electronics
Compact, reliable solutions for everyday devices.
Data Centers
Thermal management for high-density computing.
Semiconductor Packaging
Advanced packaging solutions for next-gen chips.
Inherent Benefits
The Occam Process delivers measurable advantages over traditional electronics manufacturing methods.
EMI/ESD Immunity
Thermal Management
Design Security
Reduced Footprint
Partner With Us
Join the growing number of industry leaders who trust The Occam Group for their mission-critical electronics needs.
Whether you're looking to improve reliability, reduce costs, or solve thermal challenges, our team is ready to help you achieve your goals.
Learn How to Partner With UsResources
Explore our library of technical papers, white papers, and case studies to learn more about the Occam Process and its applications.
- Technical Papers & White Papers
- eBook: "SAFE - Solderless Assembly for Electronics"
- Video Interviews & Presentations
