Pioneering the future of high-reliability electronics through innovation and excellence.
At The Occam Group, we are committed to revolutionizing electronics manufacturing through our patented solderless assembly technology. Our mission is to deliver superior reliability, thermal management, and cost efficiency for mission-critical applications.
We believe that the electronics of tomorrow should be built without the weaknesses of yesterday. That's why we developed the Occam Process—a breakthrough technology that eliminates solder joints entirely, creating stronger, more reliable electronic assemblies.
Our team brings decades of experience in electronics manufacturing, materials science, and business leadership.
CEO & Founder
Leading the vision for next-generation electronics manufacturing.
CTO
Driving innovation in solderless assembly technology.
COO
Ensuring excellence in every aspect of our operations.
The Occam Group is proudly headquartered in the United States. Our technology is developed and manufactured domestically, ensuring the highest standards of quality and security for our customers.
Ready to explore how The Occam Group can transform your electronics manufacturing?
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