From defense applications to consumer electronics, the Occam Process delivers reliability where it matters most.
Defense and aerospace applications demand electronics that perform flawlessly under the most extreme conditions. The Occam Process eliminates solder joints—the most common point of failure—delivering unmatched reliability for mission-critical systems.
Medical devices require zero tolerance for failure. Our solderless technology provides the reliability that life-saving devices demand, while enabling smaller form factors and improved thermal management.
Modern vehicles rely on increasingly complex electronics. The Occam Process delivers the reliability and thermal performance needed for electric vehicles, autonomous systems, and advanced safety features.
Consumer devices continue to shrink while demanding more performance. Our technology enables smaller, more reliable products with improved thermal characteristics.
Data centers face constant pressure to increase compute density while managing thermal loads. The Occam Process provides superior heat dissipation without the reliability concerns of traditional solder.
As chip geometries shrink, packaging becomes increasingly critical. Our technology enables advanced packaging solutions with superior thermal and electrical performance.
Contact us to discuss how the Occam Process can address your specific market needs.
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