Our patented solderless assembly technology that delivers superior reliability, lower costs, and smaller electronics systems.
The Occam Process is a revolutionary solderless assembly method that creates direct metallurgical bonds between electronic components and their substrates—completely eliminating traditional solder joints.
Named after Occam's Razor—the principle that the simplest solution is often the best—our process strips away unnecessary complexity in electronics manufacturing while dramatically improving performance.
By bonding components first and then building the circuitry around them, we create assemblies that are more reliable, more thermally efficient, and more cost-effective than traditional methods.
The Occam Process follows a fundamentally different approach to electronics assembly.
Components are precisely positioned on a thermally conductive substrate.
Direct metallurgical bonds are formed between components and substrate.
Additive manufacturing creates the circuitry around the bonded components.
Final protective layers complete the robust, reliable assembly.
Eliminates the most common failure mode in electronics—solder joint fatigue.
Direct thermal paths eliminate heat bottlenecks for better cooling.
Embedded components create smaller, lighter assemblies.
Fewer steps, less material, and reduced rework save money.
Inherent shielding provides electromagnetic protection.
Embedded components make reverse engineering extremely difficult.
Discover how The Occam Process can transform your electronics manufacturing.
